Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
A Decade of High Accuracy Die Attach Equipment and Process Developments (Addressing Photonics Device Packaging Challenges)
A Decade of High Accuracy Die Attach Equipment and Process Developments (Addressing Photonics Device Packaging Challenges)
Weinhaendler, Johann, Rudolf Kaiser, and Hardy Kellermann. 2014. “A Decade of High Accuracy Die Attach Equipment and Process Developments (Addressing Photonics Device Packaging Challenges).” IMAPSource Proceedings 2014 (DPC): 1727–58. https://doi.org/10.4071/2014DPC-wp33.
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