Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:42946/feed
Device Packaging Conference Presentations
Vol. 2014, Issue DPC, 2014January 01, 2014 EDT

A Decade of High Accuracy Die Attach Equipment and Process Developments (Addressing Photonics Device Packaging Challenges)

Johann Weinhaendler, Rudolf Kaiser, Hardy Kellermann,
High Accuracy Die Attach (< 0.5um)Manufacturability and automation challengesProcess Development
https://doi.org/10.4071/2014DPC-wp33
IMAPSource Conference Papers
Weinhaendler, Johann, Rudolf Kaiser, and Hardy Kellermann. 2014. “A Decade of High Accuracy Die Attach Equipment and Process Developments (Addressing Photonics Device Packaging Challenges).” IMAPSource Proceedings 2014 (DPC): 1727–58. https:/​/​doi.org/​10.4071/​2014DPC-wp33.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system