Uhrmann, Thomas, Jürgen Burggraf, Harald Wiesbauer, Julian Bravin, Thorsten Matthias, Markus Wimplinger, Paul Lindner, et al. 2014. “Temporary Bonding Cost Of Ownership: The Link between Low Total Thickness Variation and Chip Yield.”
IMAPSource Proceedings 2014 (DPC): 1893–1912.
https://doi.org/10.4071/2014DPC-tha11.