ISSN 2380-4505
Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
Temporary Bonding Cost Of Ownership: The link between low total thickness variation and chip yield
Temporary Bonding Cost Of Ownership: The link between low total thickness variation and chip yield
Thomas Uhrmann, Jürgen Burggraf, Harald Wiesbauer, Julian Bravin, Thorsten Matthias, Markus Wimplinger, Paul Lindner, Herman Meynen, Yann Civale, Ranjith John, Sheng Wang, Peng-Fei Fu, Craig Yeakle, Gary Aw,
Uhrmann, Thomas, Jürgen Burggraf, Harald Wiesbauer, Julian Bravin, Thorsten Matthias, Markus Wimplinger, Paul Lindner, et al. 2014. “Temporary Bonding Cost Of Ownership: The Link between Low Total Thickness Variation and Chip Yield.” IMAPSource Proceedings 2014 (DPC): 1893–1912. https://doi.org/10.4071/2014DPC-tha11.