Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
Metrology and Inspection for New Interconnects in Advanced Packaging
Metrology and Inspection for New Interconnects in Advanced Packaging
Russ Dudley, Matt Wilson, Rajiv Roy,
Dudley, Russ, Matt Wilson, and Rajiv Roy. 2014. “Metrology and Inspection for New Interconnects in Advanced Packaging.” IMAPSource Proceedings 2014 (DPC): 1536–52. https://doi.org/10.4071/2014DPC-wp16.