Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
Packaging Materials for Flip Chip and WLP: Underfill Design Using FEM for FC-BGA, FC-CSP, and Moving Towards 2.5/3D.
Packaging Materials for Flip Chip and WLP: Underfill Design Using FEM for FC-BGA, FC-CSP, and Moving Towards 2.5/3D.
Brian Schmaltz, Yukinari Abe, Kazuyuki Kohara,
Schmaltz, Brian, Yukinari Abe, and Kazuyuki Kohara. 2014. “Packaging Materials for Flip Chip and WLP: Underfill Design Using FEM for FC-BGA, FC-CSP, and Moving Towards 2.5/3D.” IMAPSource Proceedings 2014 (DPC): 1295–1327. https://doi.org/10.4071/2014DPC-wa22.