Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
ARM Dual Core Product Demonstration with 2.5D Through-Silicon-Via (TSV)
ARM Dual Core Product Demonstration with 2.5D Through-Silicon-Via (TSV)
Michael Kelly, Rick Reed,
Kelly, Michael, and Rick Reed. 2014. “ARM Dual Core Product Demonstration with 2.5D Through-Silicon-Via (TSV).” IMAPSource Proceedings 2014 (DPC): 665–93. https://doi.org/10.4071/2014DPC-tp11.