Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
High Throughput Thin Wafer Support Technology for 3DIC
High Throughput Thin Wafer Support Technology for 3DIC
John Moore, Jared Pettit, David Young, Alman Law,
Moore, John, Jared Pettit, David Young, and Alman Law. 2014. “High Throughput Thin Wafer Support Technology for 3DIC.” IMAPSource Proceedings 2014 (DPC): 1–36. https://doi.org/10.4071/2014DPC-wp13.