Vol. 2014, Issue DPC, 2014January 01, 2014 EDT
Manufacturing Readiness of BVA(TM) Technology for Fine-Pitch Package-on-Package
Manufacturing Readiness of BVA(TM) Technology for Fine-Pitch Package-on-Package
Wael Zohni, Rajesh Katkar, Rey Co, Rizza Cizek,
Zohni, Wael, Rajesh Katkar, Rey Co, and Rizza Cizek. 2014. “Manufacturing Readiness of BVA(TM) Technology for Fine-Pitch Package-on-Package.” IMAPSource Proceedings 2014 (DPC): 930–59. https://doi.org/10.4071/2014DPC-tp26.