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Device Packaging Conference Presentations
Vol. 2014, Issue DPC, 2014
January 01, 2014 EDT
Manufacturing Readiness of BVA(TM) Technology for Fine-Pitch Package-on-Package
Wael Zohni
,
Rajesh Katkar
,
Rey Co
,
Rizza Cizek
,
BVA
Fine-Pitch
Package-on-Package
•
https://doi.org/10.4071/2014DPC-tp26
IMAPSource Conference Papers
Zohni, Wael, Rajesh Katkar, Rey Co, and Rizza Cizek. 2014. “Manufacturing Readiness of BVA(TM) Technology for Fine-Pitch Package-on-Package.”
IMAPSource Proceedings
2014 (DPC): 930–59.
https://doi.org/10.4071/2014DPC-tp26
.
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