Vol. 2019, Issue HiTen, 2019July 01, 2019 EDT
Bonding strength of Cu/Cu joints using sintering process of micro-sized Cu particles for high-temperature application
Bonding strength of Cu/Cu joints using sintering process of micro-sized Cu particles for high-temperature application
Nishikawa, Hiroshi, and Xiangdong Liu. 2019. “Bonding Strength of Cu/Cu Joints Using Sintering Process of Micro-Sized Cu Particles for High-Temperature Application.” IMAPSource Proceedings 2019 (HiTen): 85–90. https://doi.org/10.4071/2380-4491.2019.HiTen.000085.
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