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High Temperature Conference Papers
Vol. 2019, Issue HiTen, 2019
July 01, 2019 EDT
Origami for Tight Spaces - 3D 250C PCB Assemblies for Control Systems
Piers Tremlett
,
Phil Elliot
,
Pablo Tena
,
origami
3D
250C
PCB
printed circuit board
high temperature
sensors
actuators
•
https://doi.org/10.4071/2380-4491.2019.HiTen.000034
IMAPSource Conference Papers
Tremlett, Piers, Phil Elliot, and Pablo Tena. 2019. “Origami for Tight Spaces - 3D 250C PCB Assemblies for Control Systems.”
IMAPSource Proceedings
2019 (HiTen): 34–38.
https://doi.org/10.4071/2380-4491.2019.HiTen.000034
.
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