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High Temperature Conference Papers
Vol. 2019, Issue HiTen, 2019
July 01, 2019 EDT
The Impact of AuSn Preforms Thickness on Solder Joint Reliability
Bernard Leavitt
,
preform
laser
semiconductor
die-attach
intermetallic
ultra-thin
solder
joint strength
•
https://doi.org/10.4071/2380-4491.2019.HiTen.000056
IMAPSource Conference Papers
Leavitt, Bernard. 2019. “The Impact of AuSn Preforms Thickness on Solder Joint Reliability.”
IMAPSource Proceedings
2019 (HiTen): 56–60.
https://doi.org/10.4071/2380-4491.2019.HiTen.000056
.
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