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High Temperature Conference Papers
Vol. 2019, Issue HiTen, 2019July 01, 2019 EDT

Fabrication of highly reliable joint based on Cu@Ni@Sn double-layer powder for high temperature application

Hongyan Xu, Yaochun Shen, Yihua Hu, Jianqiang Li, Ju Xu,
three-dimensional network high reliability interfacial structure design transient liquid phase bonding shear strength
• https://doi.org/10.4071/2380-4491.2019.HiTen.000075
IMAPSource Conference Papers
Xu, Hongyan, Yaochun Shen, Yihua Hu, Jianqiang Li, and Ju Xu. 2019. “Fabrication of Highly Reliable Joint Based on Cu@Ni@Sn Double-Layer Powder for High Temperature Application.” IMAPSource Proceedings 2019 (HiTen): 75–84. https://doi.org/10.4071/2380-4491.2019.HiTen.000075.
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