ISSN 2380-4505
Vol. 2019, Issue HiTen, 2019July 01, 2019 EDT
Fabrication of highly reliable joint based on Cu@Ni@Sn double-layer powder for high temperature application
Fabrication of highly reliable joint based on Cu@Ni@Sn double-layer powder for high temperature application
Hongyan Xu, Yaochun Shen, Yihua Hu, Jianqiang Li, Ju Xu,
Xu, Hongyan, Yaochun Shen, Yihua Hu, Jianqiang Li, and Ju Xu. 2019. “Fabrication of Highly Reliable Joint Based on Cu@Ni@Sn Double-Layer Powder for High Temperature Application.” IMAPSource Proceedings 2019 (HiTen): 75–84. https://doi.org/10.4071/2380-4491.2019.HiTen.000075.