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High Temperature Conference Papers
Vol. 2019, Issue HiTen, 2019July 01, 2019 EDT

Parametric study of electronics components joining using reactive films for high temperature applications

Rabih Khazaka, Donatien Martineau, Toni Youssef, Thanh Long Le, Stéphane Azzopardi,
Reactive filmnanolayerssolderingvoid ratioshear strengthhigh temperature electronics
https://doi.org/10.4071/2380-4491.2019.HiTen.000016
IMAPSource Conference Papers
Khazaka, Rabih, Donatien Martineau, Toni Youssef, Thanh Long Le, and Stéphane Azzopardi. 2019. “Parametric Study of Electronics Components Joining Using Reactive Films for High Temperature Applications.” IMAPSource Proceedings 2019 (HiTen): 16–21. https:/​/​doi.org/​10.4071/​2380-4491.2019.HiTen.000016.
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