Vol. 2019, Issue HiTen, 2019July 01, 2019 EDT
Parametric study of electronics components joining using reactive films for high temperature applications
Parametric study of electronics components joining using reactive films for high temperature applications
Rabih Khazaka, Donatien Martineau, Toni Youssef, Thanh Long Le, Stéphane Azzopardi,
Khazaka, Rabih, Donatien Martineau, Toni Youssef, Thanh Long Le, and Stéphane Azzopardi. 2019. “Parametric Study of Electronics Components Joining Using Reactive Films for High Temperature Applications.” IMAPSource Proceedings 2019 (HiTen): 16–21. https://doi.org/10.4071/2380-4491.2019.HiTen.000016.