Vol. 2019, Issue HiTen, 2019July 01, 2019 EDT
Study of Thermal Stress in Nano Silver Bonded Silicon Substrates for High Temperature Applications
Study of Thermal Stress in Nano Silver Bonded Silicon Substrates for High Temperature Applications
G.D. Liu, C.H. Wang,
Liu, G.D., and C.H. Wang. 2019. “Study of Thermal Stress in Nano Silver Bonded Silicon Substrates for High Temperature Applications.” IMAPSource Proceedings 2019 (HiTen): 52–55. https://doi.org/10.4071/2380-4491.2019.HiTen.000052.