Vol. 2019, Issue HiTen, 2019July 01, 2019 EDT
A modular application specific active test environment for high-temperature wafer test up to 300 °C
A modular application specific active test environment for high-temperature wafer test up to 300 °C
Michael Meister, Marco Reinhard,
Meister, Michael, and Marco Reinhard. 2019. “A Modular Application Specific Active Test Environment for High-Temperature Wafer Test up to 300 °C.” IMAPSource Proceedings 2019 (HiTen): 122–25. https://doi.org/10.4071/2380-4491.2019.HiTen.000122.