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Device Packaging Conference Presentations
Vol. 2019, Issue DPC, 2019
January 01, 2019 EDT
Solder-Joint Reliability of BGA Packages in Automotive Applications
Burton Carpenter
,
Andrew Mawer
,
Mollie Benson
,
John Arthur
,
Betty Young
,
Solder-joint reliability
Thermal fatigue
SAC
•
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TA3_040
IMAPSource Conference Papers
Carpenter, Burton, Andrew Mawer, Mollie Benson, John Arthur, and Betty Young. 2019. “Solder-Joint Reliability of BGA Packages in Automotive Applications.”
IMAPSource Proceedings
2019 (DPC): 236–57.
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TA3_040
.
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