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Device Packaging Conference Presentations
Vol. 2019, Issue DPC, 2019January 01, 2019 EDT

Solder-Joint Reliability of BGA Packages in Automotive Applications

Burton Carpenter, Andrew Mawer, Mollie Benson, John Arthur, Betty Young,
Solder-joint reliabilityThermal fatigueSAC
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TA3_040
IMAPSource Conference Papers
Carpenter, Burton, Andrew Mawer, Mollie Benson, John Arthur, and Betty Young. 2019. “Solder-Joint Reliability of BGA Packages in Automotive Applications.” IMAPSource Proceedings 2019 (DPC): 236–57. https:/​/​doi.org/​10.4071/​2380-4491-2019-DPC-Presentation_TA3_040.
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