Vol. 2019, Issue DPC, 2019January 01, 2019 EDT
Solder-Joint Reliability of BGA Packages in Automotive Applications
Solder-Joint Reliability of BGA Packages in Automotive Applications
Burton Carpenter, Andrew Mawer, Mollie Benson, John Arthur, Betty Young,
Carpenter, Burton, Andrew Mawer, Mollie Benson, John Arthur, and Betty Young. 2019. “Solder-Joint Reliability of BGA Packages in Automotive Applications.” IMAPSource Proceedings 2019 (DPC): 236–57. https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TA3_040.