Through Glass Vias for hermetically sealed High Frequency Application

Kevin Kröhnert; M. Wöhrmann; N. Jürgensen; K. D. Lang; T. Galler; T. Chaloun; C. Waldschmidt; M. Schulz-Ruhtenberg; N. Ambrosius; R. Ostholt

doi:10.4071/2380-4491-2019-DPC-Presentation_TA1_011

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Kröhnert, Kevin, M. Wöhrmann, N. Jürgensen, K. D. Lang, T. Galler, T. Chaloun, C. Waldschmidt, M. Schulz-Ruhtenberg, N. Ambrosius, and R. Ostholt. 2019. “Through Glass Vias for Hermetically Sealed High Frequency Application.” IMAPSource Proceedings 2019 (DPC): 125–40. https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TA1_011.

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