Vol. 2019, Issue DPC, 2019January 01, 2019 EDT
Through Glass Vias for hermetically sealed High Frequency Application
Through Glass Vias for hermetically sealed High Frequency Application
Kevin Kröhnert, M. Wöhrmann, N. Jürgensen, K. D. Lang, T. Galler, T. Chaloun, C. Waldschmidt, M. Schulz-Ruhtenberg, N. Ambrosius, R. Ostholt,
Kröhnert, Kevin, M. Wöhrmann, N. Jürgensen, K. D. Lang, T. Galler, T. Chaloun, C. Waldschmidt, M. Schulz-Ruhtenberg, N. Ambrosius, and R. Ostholt. 2019. “Through Glass Vias for Hermetically Sealed High Frequency Application.” IMAPSource Proceedings 2019 (DPC): 125–40. https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TA1_011.