Vol. 2019, Issue DPC, 2019January 01, 2019 EDT
Packaging Trends and Challenges for Power Devices
Packaging Trends and Challenges for Power Devices
E. Jan Vardaman,
Vardaman, E. Jan. 2019. “Packaging Trends and Challenges for Power Devices.” IMAPSource Proceedings 2019 (DPC): 706–28. https://doi.org/10.4071/2380-4491-2019-DPC-GBC2_TechSearch.