Vol. 2019, Issue DPC, 2019January 01, 2019 EDT
Novel Formaldehyde-Free Electroless Copper for Plating on Next Generation Substrates
Novel Formaldehyde-Free Electroless Copper for Plating on Next Generation Substrates
Christian Wendeln, Edith Steinhäuser, Lutz Stamp, Bexy Dosse-Gomez, Elisa Langhammer, Sebastian Reiber, Sebastian Dünnebeil, Sandra Röseler, Roger Massey,
Wendeln, Christian, Edith Steinhäuser, Lutz Stamp, Bexy Dosse-Gomez, Elisa Langhammer, Sebastian Reiber, Sebastian Dünnebeil, Sandra Röseler, and Roger Massey. 2019. “Novel Formaldehyde-Free Electroless Copper for Plating on Next Generation Substrates.” IMAPSource Proceedings 2019 (DPC): 977–1004. https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_WP2_038.