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Device Packaging Conference Presentations
Vol. 2019, Issue DPC, 2019January 01, 2019 EDT

Novel Formaldehyde-Free Electroless Copper for Plating on Next Generation Substrates

Christian Wendeln, Edith Steinhäuser, Lutz Stamp, Bexy Dosse-Gomez, Elisa Langhammer, Sebastian Reiber, Sebastian Dünnebeil, Sandra Röseler, Roger Massey,
Electroless CopperFormaldehyde freeIC Substrates
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_WP2_038
IMAPSource Conference Papers
Wendeln, Christian, Edith Steinhäuser, Lutz Stamp, Bexy Dosse-Gomez, Elisa Langhammer, Sebastian Reiber, Sebastian Dünnebeil, Sandra Röseler, and Roger Massey. 2019. “Novel Formaldehyde-Free Electroless Copper for Plating on Next Generation Substrates.” IMAPSource Proceedings 2019 (DPC): 977–1004. https:/​/​doi.org/​10.4071/​2380-4491-2019-DPC-Presentation_WP2_038.
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