Novel Formaldehyde-Free Electroless Copper for Plating on Next Generation Substrates

Christian Wendeln; Edith Steinhäuser; Lutz Stamp; Bexy Dosse-Gomez; Elisa Langhammer; Sebastian Reiber; Sebastian Dünnebeil; Sandra Röseler; Roger Massey

doi:10.4071/2380-4491-2019-DPC-Presentation_WP2_038

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Wendeln, Christian, Edith Steinhäuser, Lutz Stamp, Bexy Dosse-Gomez, Elisa Langhammer, Sebastian Reiber, Sebastian Dünnebeil, Sandra Röseler, and Roger Massey. 2019. “Novel Formaldehyde-Free Electroless Copper for Plating on Next Generation Substrates.” IMAPSource Proceedings 2019 (DPC): 977–1004. https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_WP2_038.

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