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Device Packaging Conference Presentations
Vol. 2019, Issue DPC, 2019
January 01, 2019 EDT
Semiconductor-on-Polymer Wafer Level Chip Scale Packaging
Doug Hackler
,
ultrathin
wafer-level-chip-scale-package
flipchip direct interconnect
•
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_THA2_007
IMAPSource Conference Papers
Hackler, Doug. 2019. “Semiconductor-on-Polymer Wafer Level Chip Scale Packaging.”
IMAPSource Proceedings
2019 (DPC): 1232–56.
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_THA2_007
.
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