Vol. 2019, Issue DPC, 2019January 01, 2019 EDT
Advanced barrier and seed layer deposition enabling multiple type of TSVs integration
Advanced barrier and seed layer deposition enabling multiple type of TSVs integration
Thierry Mourier, Mathilde Gottardi, Pierre-Emile Philip, Sophie Verrun, Gilles Romero, Gaelle Guittet, Céline Doussot, Vincent Mevellec,
Mourier, Thierry, Mathilde Gottardi, Pierre-Emile Philip, Sophie Verrun, Gilles Romero, Gaelle Guittet, Céline Doussot, and Vincent Mevellec. 2019. “Advanced Barrier and Seed Layer Deposition Enabling Multiple Type of TSVs Integration.” IMAPSource Proceedings 2019 (DPC): 77–103. https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TA1_061.