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Device Packaging Conference Presentations
Vol. 2019, Issue DPC, 2019
January 01, 2019 EDT
Copper Ball Voids: Failure Mechanisms and Methods of Controlling at High Temperature Automotive Application
Chu-Chung Lee
,
TuAnh Tran
,
Varughese Mathew
,
Rusli Ibrahim
,
Poh-Leng Eu
,
Cu wire bonding
PdCu wires
Automotive
•
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TP3_013
IMAPSource Conference Papers
Lee, Chu-Chung, TuAnh Tran, Varughese Mathew, Rusli Ibrahim, and Poh-Leng Eu. 2019. “Copper Ball Voids: Failure Mechanisms and Methods of Controlling at High Temperature Automotive Application.”
IMAPSource Proceedings
2019 (DPC): 519–30.
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TP3_013
.
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