Solder paste wicking in socketable BGAs | Published in IMAPSource Proceedings

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IMAPSource Conference Papers

Gupte, Omkar, Vanessa Smet, Gregorio Murtagian, and Rao Tummala. 2019. “Solder Paste Wicking in Socketable BGAs.” IMAPSource Proceedings 2019 (DPC): 429–52. https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TP2_024.

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