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Device Packaging Conference Presentations
Vol. 2019, Issue DPC, 2019
January 01, 2019 EDT
Solder paste wicking in socketable BGAs
Omkar Gupte
,
Vanessa Smet
,
Gregorio Murtagian
,
Rao Tummala
,
Ball Attach
Socketable BGA
Solder paste wicking
•
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TP2_024
IMAPSource Conference Papers
Gupte, Omkar, Vanessa Smet, Gregorio Murtagian, and Rao Tummala. 2019. “Solder Paste Wicking in Socketable BGAs.”
IMAPSource Proceedings
2019 (DPC): 429–52.
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TP2_024
.
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