Vol. 2019, Issue DPC, 2019January 01, 2019 EDT
Power Module Packaging: Market and Technology Trends
Power Module Packaging: Market and Technology Trends
Elena Barbarini, Claire Troadec,
Barbarini, Elena, and Claire Troadec. 2019. “Power Module Packaging: Market and Technology Trends.” IMAPSource Proceedings 2019 (DPC): 749–79. https://doi.org/10.4071/2380-4491-2019-DPC-GBC4_Yole.