ISSN 2380-4505
Vol. 2019, Issue DPC, 2019January 01, 2019 EDT
Investigation of a Proactive Glass Filler Removal in IC Substrate Build Up Films and its Effect on Topography and Copper Adhesion Reliability
Investigation of a Proactive Glass Filler Removal in IC Substrate Build Up Films and its Effect on Topography and Copper Adhesion Reliability
Stefan Kempa, Wolfgang Friz, Florian Gaul, Ellen Habig, Laurence J. Gregoriades, Roger Massey,
Kempa, Stefan, Wolfgang Friz, Florian Gaul, Ellen Habig, Laurence J. Gregoriades, and Roger Massey. 2019. “Investigation of a Proactive Glass Filler Removal in IC Substrate Build Up Films and Its Effect on Topography and Copper Adhesion Reliability.” IMAPSource Proceedings 2019 (DPC): 453–73. https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TP2_037.