Microbump Processing for 3D IC Integration | Published in IMAPSource Proceedings

Loading [Contrib]/a11y/accessibility-menu.js

IMAPSource Conference Papers

Li, Feng, Andrew W. Owens, and Qianyi Li. 2019. “Microbump Processing for 3D IC Integration.” IMAPSource Proceedings 2019 (DPC): 1028–49. https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_WP2_049.

View more stats