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Device Packaging Conference Presentations
Vol. 2019, Issue DPC, 2019
January 01, 2019 EDT
Photosensitive Glass-Ceramics for Heterogeneous Integration
Jeb Flemming
,
Kyle McWethy
,
Tim Mezel
,
Luis Chenoweth
,
Carrie Schmidt
,
Through Glass Vias
Integrated Passive Devices
Radio Frequency
•
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_WP1_036
IMAPSource Conference Papers
Flemming, Jeb, Kyle McWethy, Tim Mezel, Luis Chenoweth, and Carrie Schmidt. 2019. “Photosensitive Glass-Ceramics for Heterogeneous Integration.”
IMAPSource Proceedings
2019 (DPC): 880–907.
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_WP1_036
.
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