Vol. 2019, Issue DPC, 2019January 01, 2019 EDT
Embedded SIP Modules for next-GEN Heterogeneous “POWER-Devices”
Embedded SIP Modules for next-GEN Heterogeneous “POWER-Devices”
Kevin Moody, Nick Stukan,
Moody, Kevin, and Nick Stukan. 2019. “Embedded SIP Modules for Next-GEN Heterogeneous ‘POWER-Devices.’” IMAPSource Proceedings 2019 (DPC): 383–407. https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TP1_073.