Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Device Packaging Conference Presentations
Vol. 2019, Issue DPC, 2019
January 01, 2019 EDT
Power electronics thermal solutions using thermally conductive polyimide films
Rajesh Tripathi
,
Sejin Im
,
Douglas Devoto
,
Joshua Major
,
Sreekant Narumanchi
,
Paul Paret
,
Xuhui Feng
,
Direct Bond Copper
Thermal conductivity
Reliability
•
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TP3_042
IMAPSource Conference Papers
Tripathi, Rajesh, Sejin Im, Douglas Devoto, Joshua Major, Sreekant Narumanchi, Paul Paret, and Xuhui Feng. 2019. “Power Electronics Thermal Solutions Using Thermally Conductive Polyimide Films.”
IMAPSource Proceedings
2019 (DPC): 616–46.
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TP3_042
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats