Vol. 2019, Issue DPC, 2019January 01, 2019 EDT
Power electronics thermal solutions using thermally conductive polyimide films
Power electronics thermal solutions using thermally conductive polyimide films
Rajesh Tripathi, Sejin Im, Douglas Devoto, Joshua Major, Sreekant Narumanchi, Paul Paret, Xuhui Feng,
Tripathi, Rajesh, Sejin Im, Douglas Devoto, Joshua Major, Sreekant Narumanchi, Paul Paret, and Xuhui Feng. 2019. “Power Electronics Thermal Solutions Using Thermally Conductive Polyimide Films.” IMAPSource Proceedings 2019 (DPC): 616–46. https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TP3_042.