Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:40836/feed
Device Packaging Conference Presentations
Vol. 2019, Issue DPC, 2019January 01, 2019 EDT

Cost Comparison of Panel Level and Wafer Level Fan-out Packaging

Amy Lujan,
panel processingfan-out wafer level packagingcost comparison
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TA2_001
IMAPSource Conference Papers
Lujan, Amy. 2019. “Cost Comparison of Panel Level and Wafer Level Fan-out Packaging.” IMAPSource Proceedings 2019 (DPC): 141–64. https:/​/​doi.org/​10.4071/​2380-4491-2019-DPC-Presentation_TA2_001.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system