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Device Packaging Conference Presentations
Vol. 2019, Issue DPC, 2019
January 01, 2019 EDT
Cost Comparison of Panel Level and Wafer Level Fan-out Packaging
Amy Lujan
,
panel processing
fan-out wafer level packaging
cost comparison
•
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TA2_001
IMAPSource Conference Papers
Lujan, Amy. 2019. “Cost Comparison of Panel Level and Wafer Level Fan-out Packaging.”
IMAPSource Proceedings
2019 (DPC): 141–64.
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TA2_001
.
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