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Device Packaging Conference Presentations
Vol. 2019, Issue DPC, 2019January 01, 2019 EDT

The Advantages of using 3D Printed MEMS Devices

Arthur Bond, Brent Bottenfield, Mark L. Adams, Robert N. Dean,
IsolatorFixturePrinting3D Printedmems
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_WP3_023
IMAPSource Conference Papers
Bond, Arthur, Brent Bottenfield, Mark L. Adams, and Robert N. Dean. 2019. “The Advantages of Using 3D Printed MEMS Devices.” IMAPSource Proceedings 2019 (DPC): 1050–63. https:/​/​doi.org/​10.4071/​2380-4491-2019-DPC-Presentation_WP3_023.
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