Vol. 2019, Issue DPC, 2019January 01, 2019 EDT
Temporary and permanent bonding enables 3D integration of ultrathin wafers
Temporary and permanent bonding enables 3D integration of ultrathin wafers
Elisabeth Brandl, Thomas Uhrmann, Mariana Pires, Stefan Jung, Jürgen Burggraf, Matthew Koch,
Brandl, Elisabeth, Thomas Uhrmann, Mariana Pires, Stefan Jung, Jürgen Burggraf, and Matthew Koch. 2019. “Temporary and Permanent Bonding Enables 3D Integration of Ultrathin Wafers.” IMAPSource Proceedings 2019 (DPC): 1118–44. https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_THA1_051.