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Device Packaging Conference Presentations
Vol. 2019, Issue DPC, 2019
January 01, 2019 EDT
Sensor Integration: Feynman or Moore?
Benedetto Vigna
,
sensors
sensor integration
feynman roadmap
•
https://doi.org/10.4071/2380-4491-2019-DPC-Keynote1_Vigna
IMAPSource Conference Papers
Vigna, Benedetto. 2019. “Sensor Integration: Feynman or Moore?”
IMAPSource Proceedings
2019 (DPC): 1–51.
https://doi.org/10.4071/2380-4491-2019-DPC-Keynote1_Vigna
.
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