ISSN 2380-4505
Vol. 2019, Issue DPC, 2019January 01, 2019 EDT
Low Temperature flip chip bonding technology applicable to flexible hybrid electronics in the IoT era
Low Temperature flip chip bonding technology applicable to flexible hybrid electronics in the IoT era
Hiroshi Komatsu,
Komatsu, Hiroshi. 2019. “Low Temperature Flip Chip Bonding Technology Applicable to Flexible Hybrid Electronics in the IoT Era.” IMAPSource Proceedings 2019 (DPC): 474–518. https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TP2_056.