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Device Packaging Conference Presentations
Vol. 2019, Issue DPC, 2019January 01, 2019 EDT

Processing Through Glass Via (TGV) Interposers

Charles G. Woychik, John Lauffer, Scott Pollard+, Raj Parmar+, Michael Gaige, William Wilson, James Carey, Matthew Neely,
interposer TGV substrate
• https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TA1_028
IMAPSource Conference Papers
Woychik, Charles G., John Lauffer, Scott Pollard+, Raj Parmar+, Michael Gaige, William Wilson, James Carey, and Matthew Neely. 2019. “Processing Through Glass Via (TGV) Interposers.” IMAPSource Proceedings 2019 (DPC): 104–24. https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TA1_028.
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