Vol. 2019, Issue DPC, 2019January 01, 2019 EDT
Multi-chip module integration of Hybrid Silicon CMOS and GaN Technologies for RF Transceivers
Multi-chip module integration of Hybrid Silicon CMOS and GaN Technologies for RF Transceivers
Jennifer Kitchen, Soroush Moallemi, Sumit Bhardwaj,
Kitchen, Jennifer, Soroush Moallemi, and Sumit Bhardwaj. 2019. “Multi-Chip Module Integration of Hybrid Silicon CMOS and GaN Technologies for RF Transceivers.” IMAPSource Proceedings 2019 (DPC): 339–82. https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TP1_010.