This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search
  • LinkedIn (opens in a new tab)
  • RSS feed (opens a modal with a link to feed)

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:30262/feed
ISSN 2380-4505
Device Packaging Conference Presentations
Vol. 2019, Issue DPC, 2019January 01, 2019 EDT

Package Technologies for the 4th Industrial Revolution

Dan Oh,
SiPhigh-end computingfan-out package
https://doi.org/10.4071/2380-4491-2019-DPC-Keynote4_DanOh
IMAPSource Conference Papers
Oh, Dan. 2019. “Package Technologies for the 4th Industrial Revolution.” IMAPSource Proceedings 2019 (DPC): 1095–1117. https:/​/​doi.org/​10.4071/​2380-4491-2019-DPC-Keynote4_DanOh.

View more stats

Powered by Scholastica, the modern academic journal management system