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Device Packaging Conference Presentations
Vol. 2019, Issue DPC, 2019January 01, 2019 EDT

Package Technologies for the 4th Industrial Revolution

Dan Oh,
SiPhigh-end computingfan-out package
https://doi.org/10.4071/2380-4491-2019-DPC-Keynote4_DanOh
IMAPSource Conference Papers
Oh, Dan. 2019. “Package Technologies for the 4th Industrial Revolution.” IMAPSource Proceedings 2019 (DPC): 1095–1117. https:/​/​doi.org/​10.4071/​2380-4491-2019-DPC-Keynote4_DanOh.
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