Vol. 2019, Issue DPC, 2019January 01, 2019 EDT
Ultra-low Warpage and Anhydride-free Liquid Compression Molding Materials for Advanced Semiconductor Packaging
Ultra-low Warpage and Anhydride-free Liquid Compression Molding Materials for Advanced Semiconductor Packaging
Tim Champagne, Jay Chao, Kazuyasu Tanaka, Ramachandran Trichur, Rong Zhang,
Champagne, Tim, Jay Chao, Kazuyasu Tanaka, Ramachandran Trichur, and Rong Zhang. 2019. “Ultra-Low Warpage and Anhydride-Free Liquid Compression Molding Materials for Advanced Semiconductor Packaging.” IMAPSource Proceedings 2019 (DPC): 408–28. https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TP2_016.