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Device Packaging Conference Presentations
Vol. 2019, Issue DPC, 2019
January 01, 2019 EDT
Performance Comparison Between Surface-mount and Embedded Power Modules
Gerald Weis
,
surface mount
embedded
power modules
•
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TP3_052
IMAPSource Conference Papers
Weis, Gerald. 2019. “Performance Comparison Between Surface-Mount and Embedded Power Modules.”
IMAPSource Proceedings
2019 (DPC): 647–70.
https://doi.org/10.4071/2380-4491-2019-DPC-Presentation_TP3_052
.
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