Skip to main content
null
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • EMPC Conference Proceedings (IMAPS Europe)
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:25512/feed
IMAPS Chapter Conferences
Vol. 2019, Issue NOR, 2019June 01, 2019 EDT

A novel low cost roll-to-roll manufacturing compatible ultra-thin chip integration and direct metal interconnection process for flexible hybrid electronics

N Palavesam, W Hell, A Drost, C Landesberger, C Kutter, K Bock,
Chip foil packageSystem-in-Foilflexible interposerchip embeddingembedding in flex
https://doi.org/10.4071/2380-4491-2019-NOR-Palavesam
IMAPSource Conference Papers
Palavesam, N, W Hell, A Drost, C Landesberger, C Kutter, and K Bock. 2019. “A Novel Low Cost Roll-to-Roll Manufacturing Compatible Ultra-Thin Chip Integration and Direct Metal Interconnection Process for Flexible Hybrid Electronics.” IMAPSource Proceedings 2019 (NOR): 6–11. https:/​/​doi.org/​10.4071/​2380-4491-2019-NOR-Palavesam.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system