Vol. 2019, Issue NOR, 2019June 01, 2019 EDT
A novel low cost roll-to-roll manufacturing compatible ultra-thin chip integration and direct metal interconnection process for flexible hybrid electronics
A novel low cost roll-to-roll manufacturing compatible ultra-thin chip integration and direct metal interconnection process for flexible hybrid electronics
Palavesam, N, W Hell, A Drost, C Landesberger, C Kutter, and K Bock. 2019. “A Novel Low Cost Roll-to-Roll Manufacturing Compatible Ultra-Thin Chip Integration and Direct Metal Interconnection Process for Flexible Hybrid Electronics.” IMAPSource Proceedings 2019 (NOR): 6–11. https://doi.org/10.4071/2380-4491-2019-NOR-Palavesam.
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