Vol. 2019, Issue NOR, 2019June 01, 2019 EDT
Scalability of Copper-Interconnects down to 3μm on Printed Boards by Laser-assisted-subtractive process
Scalability of Copper-Interconnects down to 3μm on Printed Boards by Laser-assisted-subtractive process
Sarthak Acharya, Shailesh Singh Chouhan, Jerker Delsing,
Acharya, Sarthak, Shailesh Singh Chouhan, and Jerker Delsing. 2019. “Scalability of Copper-Interconnects down to 3μm on Printed Boards by Laser-Assisted-Subtractive Process.” IMAPSource Proceedings 2019 (NOR): 17–20. https://doi.org/10.4071/2380-4491-2019-NOR-Acharya.