Low-temperature Cu-Cu thermocompression bonding for encapsulation of a MEMS mirror

Henri Ailas; Jaakko Saarilahti; Tuomas Pensala; Jyrki Kiihamäki

doi:10.4071/2380-4491-2019-NOR-Ailas

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Ailas, Henri, Jaakko Saarilahti, Tuomas Pensala, and Jyrki Kiihamäki. 2019. “Low-Temperature Cu-Cu Thermocompression Bonding for Encapsulation of a MEMS Mirror.” IMAPSource Proceedings 2019 (NOR): 12–16. https://doi.org/10.4071/2380-4491-2019-NOR-Ailas.

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