Vol. 2019, Issue NOR, 2019June 01, 2019 EDT
Low-temperature Cu-Cu thermocompression bonding for encapsulation of a MEMS mirror
Low-temperature Cu-Cu thermocompression bonding for encapsulation of a MEMS mirror
Henri Ailas, Jaakko Saarilahti, Tuomas Pensala, Jyrki Kiihamäki,
Ailas, Henri, Jaakko Saarilahti, Tuomas Pensala, and Jyrki Kiihamäki. 2019. “Low-Temperature Cu-Cu Thermocompression Bonding for Encapsulation of a MEMS Mirror.” IMAPSource Proceedings 2019 (NOR): 12–16. https://doi.org/10.4071/2380-4491-2019-NOR-Ailas.