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Ceramics Conference Papers
Vol. 2013, Issue CICMT, 2013September 01, 2013 EDT

Advanced Surface Finishes for Ceramic Electronics for Soldering, Conductive Adhesive, Aluminum- , Gold-, and Copper Wire Bonding.

Maren Bruder, Guenter Heinz, Mustafa Oezkoek,
surface finishceramicsolderingconductive adhesivealuminumgoldcopperwire bonding
https://doi.org/10.4071/CICMT-THA41
IMAPSource Conference Papers
Bruder, Maren, Guenter Heinz, and Mustafa Oezkoek. 2013. “Advanced Surface Finishes for Ceramic Electronics for Soldering, Conductive Adhesive, Aluminum- , Gold-, and Copper Wire Bonding.” IMAPSource Proceedings 2013 (CICMT): 257–60. https:/​/​doi.org/​10.4071/​CICMT-THA41.
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