Vol. 2013, Issue CICMT, 2013September 01, 2013 EDT
Advanced Surface Finishes for Ceramic Electronics for Soldering, Conductive Adhesive, Aluminum- , Gold-, and Copper Wire Bonding.
Advanced Surface Finishes for Ceramic Electronics for Soldering, Conductive Adhesive, Aluminum- , Gold-, and Copper Wire Bonding.
Maren Bruder, Guenter Heinz, Mustafa Oezkoek,
Bruder, Maren, Guenter Heinz, and Mustafa Oezkoek. 2013. “Advanced Surface Finishes for Ceramic Electronics for Soldering, Conductive Adhesive, Aluminum- , Gold-, and Copper Wire Bonding.” IMAPSource Proceedings 2013 (CICMT): 257–60. https://doi.org/10.4071/CICMT-THA41.