Vol. 2013, Issue CICMT, 2013September 01, 2013 EDT
Joining of Sintered Alumina Substrates and LTCC Green Tapes via Cold Low Pressure Lamination
Joining of Sintered Alumina Substrates and LTCC Green Tapes via Cold Low Pressure Lamination
Michael Hambuch, Frieder Gora, Karin Beart, Frieder Wittmann, Andreas Roosen,
Hambuch, Michael, Frieder Gora, Karin Beart, Frieder Wittmann, and Andreas Roosen. 2013. “Joining of Sintered Alumina Substrates and LTCC Green Tapes via Cold Low Pressure Lamination.” IMAPSource Proceedings 2013 (CICMT): 268–74. https://doi.org/10.4071/CICMT-THA43.