Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
A Process Dependent Warpage and Stress Model for 3D Packages Considering Incoming Die/Substrate Warpage and Assembly Process Impacts
A Process Dependent Warpage and Stress Model for 3D Packages Considering Incoming Die/Substrate Warpage and Assembly Process Impacts
Lin, Wei, Ahmer Syed, KiWook Lee, and Karthikeyan Dhandapani. 2013. “A Process Dependent Warpage and Stress Model for 3D Packages Considering Incoming Die/Substrate Warpage and Assembly Process Impacts.” IMAPSource Proceedings 2013 (DPC): 1603–21. https://doi.org/10.4071/2013DPC-wp31.
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