Vol. 2013, Issue CICMT, 2013September 01, 2013 EDT
Modeling the Failure Mechanism of Electrical Vias Manufactured in Thick-Film Technology
Modeling the Failure Mechanism of Electrical Vias Manufactured in Thick-Film Technology
Dominique Ortolino, Jaroslaw Kita, Ralf Moos, Roland Wurm, Andreas Pletsch, Karin Beart,
Ortolino, Dominique, Jaroslaw Kita, Ralf Moos, Roland Wurm, Andreas Pletsch, and Karin Beart. 2013. “Modeling the Failure Mechanism of Electrical Vias Manufactured in Thick-Film Technology.” IMAPSource Proceedings 2013 (CICMT): 149–54. https://doi.org/10.4071/CICMT-2013-WP23.