Modeling the Failure Mechanism of Electrical Vias Manufactured in Thick-Film Technology

Dominique Ortolino; Jaroslaw Kita; Ralf Moos; Roland Wurm; Andreas Pletsch; Karin Beart

doi:10.4071/CICMT-2013-WP23

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Ortolino, Dominique, Jaroslaw Kita, Ralf Moos, Roland Wurm, Andreas Pletsch, and Karin Beart. 2013. “Modeling the Failure Mechanism of Electrical Vias Manufactured in Thick-Film Technology.” IMAPSource Proceedings 2013 (CICMT): 149–54. https://doi.org/10.4071/CICMT-2013-WP23.

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