Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Assembly Challenges for 2.5D Packages
Assembly Challenges for 2.5D Packages
Michael G Kelly, Marnie Mattei, Rick Reed,
Kelly, Michael G, Marnie Mattei, and Rick Reed. 2013. “Assembly Challenges for 2.5D Packages.” IMAPSource Proceedings 2013 (DPC): 592–617. https://doi.org/10.4071/2013DPC-tp11.