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Device Packaging Conference Presentations
Vol. 2013, Issue DPC, 2013
January 01, 2013 EDT
Assembly Challenges for 2.5D Packages
Michael G Kelly
,
Marnie Mattei
,
Rick Reed
,
2.5D Key learnings
Assembly
Material
•
https://doi.org/10.4071/2013DPC-tp11
IMAPSource Conference Papers
Kelly, Michael G, Marnie Mattei, and Rick Reed. 2013. “Assembly Challenges for 2.5D Packages.”
IMAPSource Proceedings
2013 (DPC): 592–617.
https://doi.org/10.4071/2013DPC-tp11
.
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