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Device Packaging Conference Presentations
Vol. 2013, Issue DPC, 2013January 01, 2013 EDT

Direct Palladium-Gold on copper as a Surface Finish for next generation Packages.

Mustafa Ozkok, Sven Lamprecht, Gustavo Ramos, Arnd Kilian,
EPEPAGSurface finishCu wire bond
https://doi.org/10.4071/2013DPC-wa24
IMAPSource Conference Papers
Ozkok, Mustafa, Sven Lamprecht, Gustavo Ramos, and Arnd Kilian. 2013. “Direct Palladium-Gold on Copper as a Surface Finish for next Generation Packages.” IMAPSource Proceedings 2013 (DPC): 1145–84. https:/​/​doi.org/​10.4071/​2013DPC-wa24.
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