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Device Packaging Conference Presentations
Vol. 2013, Issue DPC, 2013
January 01, 2013 EDT
Direct Palladium-Gold on copper as a Surface Finish for next generation Packages.
Mustafa Ozkok
,
Sven Lamprecht
,
Gustavo Ramos
,
Arnd Kilian
,
EP
EPAG
Surface finish
Cu wire bond
•
https://doi.org/10.4071/2013DPC-wa24
IMAPSource Conference Papers
Ozkok, Mustafa, Sven Lamprecht, Gustavo Ramos, and Arnd Kilian. 2013. “Direct Palladium-Gold on Copper as a Surface Finish for next Generation Packages.”
IMAPSource Proceedings
2013 (DPC): 1145–84.
https://doi.org/10.4071/2013DPC-wa24
.
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