Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Effect of Substrate Layer Variation on Package Warpage
Effect of Substrate Layer Variation on Package Warpage
Wells, Brendan C., Wei Lin, and HyunJin Park. 2013. “Effect of Substrate Layer Variation on Package Warpage.” IMAPSource Proceedings 2013 (DPC): 1086–1105. https://doi.org/10.4071/2013DPC-wa21.
Powered by Scholastica, the modern academic journal management system