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Device Packaging Conference Presentations
Vol. 2013, Issue DPC, 2013
January 01, 2013 EDT
Effect of Substrate Layer Variation on Package Warpage
Brendan C. Wells
,
Wei Lin
,
HyunJin Park
,
Substrate layer
Package warpage
Process window
•
https://doi.org/10.4071/2013DPC-wa21
IMAPSource Conference Papers
Wells, Brendan C., Wei Lin, and HyunJin Park. 2013. “Effect of Substrate Layer Variation on Package Warpage.”
IMAPSource Proceedings
2013 (DPC): 1086–1105.
https://doi.org/10.4071/2013DPC-wa21
.
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