Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Reliability of die to wafer bonding using copper-tin interconnections
Reliability of die to wafer bonding using copper-tin interconnections
Arnaud Garnier, Rémi Franiatte, David Bouchu, Romain Anciant, Séverine Chéramy,
Garnier, Arnaud, Rémi Franiatte, David Bouchu, Romain Anciant, and Séverine Chéramy. 2013. “Reliability of Die to Wafer Bonding Using Copper-Tin Interconnections.” IMAPSource Proceedings 2013 (DPC): 425–40. https://doi.org/10.4071/2013DPC-ta21.