Vol. 2013, Issue DPC, 2013January 01, 2013 EDT
Through Si Vias Using Liquid Metal Conductors for Re-workable 3D Electronics
Through Si Vias Using Liquid Metal Conductors for Re-workable 3D Electronics
George A. Hernandez, Daniel Martinez, Stephen Patenaude, Charles Ellis, Michael Palmer, Michael Hamilton,
Hernandez, George A., Daniel Martinez, Stephen Patenaude, Charles Ellis, Michael Palmer, and Michael Hamilton. 2013. “Through Si Vias Using Liquid Metal Conductors for Re-Workable 3D Electronics.” IMAPSource Proceedings 2013 (DPC): 1343–57. https://doi.org/10.4071/2013DPC-wp13.
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